On December 23, LINGWE Technology (Stock Code: 301373) announced its intention to acquire controlling stake in Jiangsu Huimai Powder Technology Co., Ltd. through a cash transaction. This acquisition represents a key strategic move for LINGWE to enter the high-end electronic materials segment and build long-term competitive advantages. Through industrial integration, the company will gain access to domestically scarce chemically synthesized spherical silica powder production capabilities, positioning itself in frontier markets such as IC substrates and advanced packaging.

The target company, Jiangsu Huimai, is a national high-tech enterprise specializing in the R&D, production, and sales of nano-spherical silica functional powders. Its core product, nano-spherical silica powder, is widely used in electronic circuit substrates, electronic packaging, electronic adhesive binders, plastic compounds, film fibers, polishing, specialty ceramics, and ink coatings. As one of the few enterprises in China to achieve industrial-scale production of high-purity ultra-fine submicron spherical silica powder, Jiangsu Huimai holds independent intellectual property rights and possesses surface modification technologies for complex organic substrates.